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MT53D1024M32D4DT-053 Micron

Name: MT53D1024M32D4DT-053 Micron
SKU: MT53D1024M32D4DT-053

Brand:

Micron

JEDEC Compliance:

JEDEC LPDDR4X compliant

ECC Support:

Inline ECC supported

Process Technology:

1Y nm-class mobile DRAM

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-channel / Multi-bank

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

200 balls

Package Size:

200-ball FBGA

VDD/VDDQ:

VDD1=1.8V / VDD2=1.1V / VDDQ=0.6V

Clock Frequency:

1866 MHz

Organization:

1G ×32

Density:

32Gb

Data Rate:

3733 MT/s

I/O Width:

x32

Package Type:

FBGA

Interface Standard:

LPDDR4X SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

Order Number:

MT53D1024M32D4DT-053

Description:

Micron advanced LPDDR4X DRAM delivering enhanced bandwidth, reduced power consumption, and reliable thermal performance for premium mobile computing, edge AI, and multimedia processing applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Micron
JEDEC Compliance：	JEDEC LPDDR4X compliant
ECC Support：	Inline ECC supported
Process Technology：	1Y nm-class mobile DRAM
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-channel / Multi-bank
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	200 balls
Package Size：	200-ball FBGA
VDD/VDDQ：	VDD1=1.8V / VDD2=1.1V / VDDQ=0.6V
Clock Frequency：	1866 MHz
Organization：	1G ×32
Density：	32Gb
Data Rate：	3733 MT/s
I/O Width：	x32
Package Type：	FBGA
Interface Standard：	LPDDR4X SDRAM
Operating Temperature Range：	-25°C to +85°C

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MT53D1024M32D4DT-053 Micron

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