Zentel
Results: 1
Brand
JEDEC Compliance
ECC Support
Process Technology
Power Saving Features
Bank Architecture
Refresh Mode
Temperature Grade
Pin/Ball Count
Package Size
VDD/VDDQ
Clock Frequency
Organization
Density
Data Rate
I/O Width
Package Type
Interface Standard
Operating Temperature Range
Product
| Image | Brand | Title | Operating Temperature Range | Interface Standard | Package Type | I/O Width | Data Rate | Density | Organization | Clock Frequency | VDD/VDDQ | Package Size | Pin/Ball Count | Temperature Grade | Refresh Mode | Bank Architecture | Power Saving Features | Process Technology | ECC Support | JEDEC Compliance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Zentel | A3T1GF40CBF-GM Zentel | 0°C to +95°C | DDR3 SDRAM | 96-ball FBGA | x16 | 1600 Mbps | 1Gb | 64M ×16 | 800 MHz | VDD=1.5V ±0.075V / VDDQ=1.5V ±0.075V | FBGA-96 | 96 balls | Commercial Grade | Auto Refresh / Self Refresh | 8 Banks | Power-Down Mode, Self Refresh, ODT, DLL-off | DDR3 DRAM process technology | No | JEDEC DDR3 compliant |





























































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