Winbond
Results: 2
Brand
ECC Requirement
Erase Time
Program Time
Block Size
Page Size
NAND Architecture
Storage Capacity
Package Type
Bus Width
Interface Standard
Interface Type
Operating Temperature Range
Operating Voltage
Product
| Image | Brand | Title | Operating Voltage | Operating Temperature Range | Interface Type | Interface Standard | Bus Width | Package Type | Storage Capacity | Read Access Time | NAND Architecture | Page Size | Block Size | Spare Area Size | Program Time | Erase Time | ECC Requirement |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Winbond | W25N02KVZEIR | 2.7 V – 3.6 V | -40°C to +85°C | Serial NAND Flash | QSPI / SPI | x1 / x2 / x4 | 8-WSON 8×6 mm | 2 Gbit (256 MB) | 50 µs typ | SLC NAND | 2048 + 128 Bytes | 128 KB (64 Pages) | 128 Bytes | 250 µs typ | 2 ms typ | On-die ECC (1-bit per 512B) | |
| Winbond | W25N01GVZEIG | 2.7 V – 3.6 V | -40°C to +85°C | Serial NAND Flash | QSPI / SPI | x1 / x2 / x4 | 8-WSON 8×6 mm | 1 Gbit (128 MB) | 7 ns | SLC NAND | 2048 + 64 Bytes | 128 KB (64 Pages) | 64 Bytes | 700 µs typ | 2 ms typ | On-die ECC (ECC enabled internally) |





























































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