ISSI
Results: 2
JEDEC Compliance
ECC Support
Process Technology
Power Saving Features
Bank Architecture
Refresh Mode
Temperature Grade
Package Size
Organization
Operating Temperature Range
Product
| Image | Brand | Title | Operating Temperature Range | Interface Standard | Package Type | I/O Width | Data Rate | Density | Organization | Clock Frequency | VDD/VDDQ | Package Size | Pin/Ball Count | Temperature Grade | Refresh Mode | Bank Architecture | Power Saving Features | Process Technology | ECC Support | JEDEC Compliance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISSI (Integrated Silicon Solution, Inc.) | IS42S16400J-7TLI-TR | -40°C to +85°C | SDR SDRAM | TSOP-II | x16 | 143 Mbps | 64Mb | 4M × 16 | 143 MHz | 3.3V ±0.3V | 400 mil TSOP-II | 54-pin | Industrial | Auto Refresh / Self Refresh | 4 Banks | Self Refresh, Power Down Mode | SDRAM Process Technology (not publicly disclosed) | No | JEDEC SDR SDRAM | |
| ISSI (Integrated Silicon Solution, Inc.) | IS43LQ32512A-046BLI | -40°C to +95°C | LPDDR4X | TFBGA | x16 ×2 | 4266 Mbps | 16Gb | 512Mb ×16 ×2 Channels | 2133 MHz | VDD1 1.70–1.95V; VDD2 1.06–1.17V; VDDQ 0.6V/1.1V | 10 mm × 14.5 mm | 200-ball | Industrial | Self Refresh / Auto Refresh | 8 Banks per Channel × 2 Channels | Deep Sleep, Clock Stop, Partial Array Self Refresh | DRAM Process Technology (not publicly disclosed) | On-Die ECC | JESD209-4 / LPDDR4X |





























































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