
SK Hynix
Results: 8
Brand
Internal Features
- 3D NAND controller, advanced ECC, cache buffering, secure RPMB
- Advanced ECC, secure write protection, cache acceleration
- Advanced V-NAND management, secure erase, internal ECC
- Industrial-grade NAND management, ECC, secure boot support
- Internal ECC, wear leveling, secure erase, cache management
- NAND flash controller, internal ECC, bad block remapping
- Wear leveling, ECC engine, TRIM support, secure erase
- Wear leveling, bad block management, internal ECC, boot partition support
Sequential Read
Pin Assignment
Power Consumption Characteristics
Bus Width
Operating Temperature Range
Operating Voltage
Product
| Image | Brand | Title | Operating Voltage | Operating Temperature Range | Interface Standard | Bus Width | Speed Mode | Power Consumption Characteristics | Pin Assignment | Storage Capacity | Sequential Read | Random Read | Internal Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SK Hynix | H26T87001CMR SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 5.1 | x8 | HS400 | Advanced power-saving modes | 153-ball FBGA | 128GB | Up to 320 MB/s | Up to 15K IOPS | 3D NAND controller, advanced ECC, cache buffering, secure RPMB | |
| SK Hynix | H26M78208CMRN SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 5.1 | x8 | HS400 | Dynamic voltage and standby management | 153-ball FBGA | 64GB | Up to 320 MB/s | Up to 13K IOPS | Advanced V-NAND management, secure erase, internal ECC | |
| SK Hynix | H26M78208CMRI SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -40°C to +85°C | eMMC 5.1 | x8 | HS400 | Industrial low-power optimization | 153-ball FBGA | 64GB | Up to 320 MB/s | Up to 13K IOPS | Industrial-grade NAND management, ECC, secure boot support | |
| SK Hynix | H26M78208CMR SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 5.1 | x8 | HS400 | Ultra-low standby current | 153-ball FBGA | 64GB | Up to 320 MB/s | Up to 13K IOPS | Wear leveling, ECC engine, TRIM support, secure erase | |
| SK Hynix | H26M78103CCR SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 5.1 | x8 | HS400 | Low-power sleep mode | 153-ball FBGA | 32GB | Up to 300 MB/s | Up to 12K IOPS | Advanced ECC, secure write protection, cache acceleration | |
| SK Hynix | H26M74002HMR SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 5.0 | x8 | HS200 | Optimized standby and active current | 153-ball FBGA | 16GB | Up to 250 MB/s | Up to 10K IOPS | NAND flash controller, internal ECC, bad block remapping | |
| SK Hynix | H26M64208EMR SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.8V | -25°C to +85°C | eMMC 4.5 | x8 | HS200 | Dynamic power management | 169-ball FBGA | 8GB | Up to 200 MB/s | Up to 8K IOPS | Internal ECC, wear leveling, secure erase, cache management | |
| SK Hynix | H26M52103FMRA SK Hynix | VCC: 2.7–3.6V, VCCQ: 1.7–1.95V | -25°C to +85°C | eMMC 4.5 | x8 | HS200 | Low standby current, sleep mode support | 169-ball FBGA | 4GB | Up to 140 MB/s | Up to 7K IOPS | Wear leveling, bad block management, internal ECC, boot partition support |





























































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