Alliance Memory
Results: 1
Brand
JEDEC Compliance
ECC Support
Process Technology
Power Saving Features
Bank Architecture
Refresh Mode
Temperature Grade
Pin/Ball Count
Package Size
Clock Frequency
Organization
Density
Data Rate
I/O Width
Package Type
Interface Standard
Operating Temperature Range
Product
| Image | Brand | Title | Operating Temperature Range | Interface Standard | Package Type | I/O Width | Data Rate | Density | Organization | Clock Frequency | VDD/VDDQ | Package Size | Pin/Ball Count | Temperature Grade | Refresh Mode | Bank Architecture | Power Saving Features | Process Technology | ECC Support | JEDEC Compliance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Alliance Memory, Inc. | ASFC8G31M-51BIN | -40°C to +85°C | eMMC 5.1 | FBGA | x8 | HS400 up to 400 MB/s | 64Gb (8GB) | 8G × 8 | 200 MHz | VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V | 11.5 × 13.0 × 1.0 mm | 153-ball | Industrial | N/A | NAND Array Architecture | Sleep Mode, Auto Power Save | 3D NAND | Internal ECC Supported | eMMC 5.1 |





























































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