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ASFC8G31M-51BIN

Name: ASFC8G31M-51BIN
SKU: ASFC8G31M-51BIN

Brand:

Alliance Memory, Inc.

JEDEC Compliance:

eMMC 5.1

ECC Support:

Internal ECC Supported

Process Technology:

3D NAND

Power Saving Features:

Sleep Mode, Auto Power Save

Bank Architecture:

NAND Array Architecture

Refresh Mode:

N/A

Temperature Grade:

Industrial

Pin/Ball Count:

153-ball

Package Size:

11.5 × 13.0 × 1.0 mm

VDD/VDDQ:

VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V

Clock Frequency:

200 MHz

Organization:

8G × 8

Density:

64Gb (8GB)

Data Rate:

HS400 up to 400 MB/s

I/O Width:

Package Type:

FBGA

Interface Standard:

eMMC 5.1

Operating Temperature Range:

-40°C to +85°C

Model:

ASFC8G31M-51BIN

Order Number:

ASFC8G31M-51BIN

Description:

WhatsApp Inquire Now

Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Alliance Memory, Inc.
JEDEC Compliance：	eMMC 5.1
ECC Support：	Internal ECC Supported
Process Technology：	3D NAND
Power Saving Features：	Sleep Mode, Auto Power Save
Bank Architecture：	NAND Array Architecture
Refresh Mode：	N/A
Temperature Grade：	Industrial
Pin/Ball Count：	153-ball
Package Size：	11.5 × 13.0 × 1.0 mm
VDD/VDDQ：	VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V
Clock Frequency：	200 MHz
Organization：	8G × 8
Density：	64Gb (8GB)
Data Rate：	HS400 up to 400 MB/s
I/O Width：	x8
Package Type：	FBGA
Interface Standard：	eMMC 5.1
Operating Temperature Range：	-40°C to +85°C

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Tom

Hi, I'm Tom. With 7 years of experience in the industrial control industry, I combine deep professionalism with a friendly, client-first approach. I am dedicated to providing complete, end-to-end services to support your business needs. Let’s collaborate to achieve your goals—please feel free to contact me today!

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ASFC8G31M-51BIN

Product parameters

Tom

Product Category

ASFC8G31M-51BIN

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