ASFC8G31M-51BIN
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Alliance Memory, Inc. | |
| JEDEC Compliance: | eMMC 5.1 | |
| ECC Support: | Internal ECC Supported | |
| Process Technology: | 3D NAND | |
| Power Saving Features: | Sleep Mode, Auto Power Save | |
| Bank Architecture: | NAND Array Architecture | |
| Refresh Mode: | N/A | |
| Temperature Grade: | Industrial | |
| Pin/Ball Count: | 153-ball | |
| Package Size: | 11.5 × 13.0 × 1.0 mm | |
| VDD/VDDQ: | VCC 2.7–3.6V; VCCQ 1.7–1.95V / 2.7–3.6V | |
| Clock Frequency: | 200 MHz | |
| Organization: | 8G × 8 | |
| Density: | 64Gb (8GB) | |
| Data Rate: | HS400 up to 400 MB/s | |
| I/O Width: | x8 | |
| Package Type: | FBGA | |
| Interface Standard: | eMMC 5.1 | |
| Operating Temperature Range: | -40°C to +85°C |

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