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K4A4G165WG-BCWE Samsung

Name: K4A4G165WG-BCWE Samsung
SKU: K4A4G165WG-BCWE

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC DDR4 compliant

ECC Support:

Process Technology:

Samsung 10nm-class DRAM process (E-die generation)

Power Saving Features:

Power-Down Mode, Self Refresh, DLL-off Mode

Bank Architecture:

16 Banks / 4 Bank Groups

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

96-ball

Package Size:

9 × 8 × 1.2 mm

VDD/VDDQ:

1.2V / 1.2V

Clock Frequency:

1600 MHz

Organization:

256M ×16

Density:

4Gb

Data Rate:

3200 Mbps

I/O Width:

x16

Package Type:

FBGA

Interface Standard:

DDR4 SDRAM

Operating Temperature Range:

0°C to +85°C

Model:

K4A4G165WG-BCWE

Order Number:

K4A4G165WG-BCWE

Description:

Samsung 4Gb DDR4 SDRAM with x16 architecture, supporting high bandwidth, improved power efficiency, and advanced reliability features for servers, industrial systems, telecom platforms, and high-performance embedded applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC DDR4 compliant
ECC Support：	No
Process Technology：	Samsung 10nm-class DRAM process (E-die generation)
Power Saving Features：	Power-Down Mode, Self Refresh, DLL-off Mode
Bank Architecture：	16 Banks / 4 Bank Groups
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	96-ball
Package Size：	9 × 8 × 1.2 mm
VDD/VDDQ：	1.2V / 1.2V
Clock Frequency：	1600 MHz
Organization：	256M ×16
Density：	4Gb
Data Rate：	3200 Mbps
I/O Width：	x16
Package Type：	FBGA
Interface Standard：	DDR4 SDRAM
Operating Temperature Range：	0°C to +85°C

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K4A4G165WG-BCWE Samsung

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