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MT53E1G32D2NP-046 WT:B Micron

Name: MT53E1G32D2NP-046 WT:B Micron
SKU: MT53E1G32D2NP-046 WT:B

Brand:

Micron

JEDEC Compliance:

LPDDR4X JEDEC

ECC Support:

No (On-die ECC not available)

Process Technology:

1x nm FinFET CMOS

Power Saving Features:

Deep Sleep Mode, Self Refresh

Bank Architecture:

16 internal banks (8 banks per channel)

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Automotive / Industrial

Pin/Ball Count:

178-ball

Package Size:

10mm x 14.5mm

VDD/VDDQ:

1.8V / 0.6V

Clock Frequency:

2.133GHz

Organization:

1G x 32

Density:

32Gb

Data Rate:

4266 MT/s

I/O Width:

32-bit

Package Type:

FBGA

Interface Standard:

LPDDR4X

Operating Temperature Range:

-25°C to +85°C

Model:

MT53E1G32D2NP-046 WT:B

Order Number:

MT53E1G32D2NP-046 WT:B

Description:

LPDDR4X SDRAM, 32Gbit, 1G x 32, 4266MT/s, 1.1V/0.6V, -25°C to +85°C, 200-ball TFBGA, Wide Temperature Grade

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Micron
JEDEC Compliance：	LPDDR4X JEDEC
ECC Support：	No (On-die ECC not available)
Process Technology：	1x nm FinFET CMOS
Power Saving Features：	Deep Sleep Mode, Self Refresh
Bank Architecture：	16 internal banks (8 banks per channel)
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Automotive / Industrial
Pin/Ball Count：	178-ball
Package Size：	10mm x 14.5mm
VDD/VDDQ：	1.8V / 0.6V
Clock Frequency：	2.133GHz
Organization：	1G x 32
Density：	32Gb
Data Rate：	4266 MT/s
I/O Width：	32-bit
Package Type：	FBGA
Interface Standard：	LPDDR4X
Operating Temperature Range：	-25°C to +85°C

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Tom

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MT53E1G32D2NP-046 WT:B Micron

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Tom

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