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MT62F2G32D4DS-023 Micron

Name: MT62F2G32D4DS-023 Micron
SKU: MT62F2G32D4DS-023

Brand:

Micron

JEDEC Compliance:

LPDDR4X JEDEC

ECC Support:

On-die ECC

Process Technology:

1znm-class DRAM

Power Saving Features:

Deep Sleep, Self Refresh, Partial Array Refresh

Bank Architecture:

8 Banks / 4 Bank Groups

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Industrial

Pin/Ball Count:

200-ball

Package Size:

10 × 14.5 mm

VDD/VDDQ:

1.8V / 0.6V

Clock Frequency:

2133 MHz

Organization:

2G × 32

Density:

64Gb

Data Rate:

4266 MT/s

I/O Width:

x32

Package Type:

FBGA

Interface Standard:

LPDDR4X

Operating Temperature Range:

-40°C to +95°C

Model:

MT62F2G32D4DS-023

Order Number:

MT62F2G32D4DS-023

Description:

Micron MT62F2G32D4DS-023 is a high-density DDR4 DRAM device engineered for demanding memory applications. It provides high-speed operation, stable signal performance, and efficient power characteristics, suitable for enterprise systems, embedded computing, telecom equipment, and data processing platforms.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Micron
JEDEC Compliance：	LPDDR4X JEDEC
ECC Support：	On-die ECC
Process Technology：	1znm-class DRAM
Power Saving Features：	Deep Sleep, Self Refresh, Partial Array Refresh
Bank Architecture：	8 Banks / 4 Bank Groups
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Industrial
Pin/Ball Count：	200-ball
Package Size：	10 × 14.5 mm
VDD/VDDQ：	1.8V / 0.6V
Clock Frequency：	2133 MHz
Organization：	2G × 32
Density：	64Gb
Data Rate：	4266 MT/s
I/O Width：	x32
Package Type：	FBGA
Interface Standard：	LPDDR4X
Operating Temperature Range：	-40°C to +95°C

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MT62F2G32D4DS-023 Micron

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