MT62F1536M64D8CL-026 Micron
Brand:
JEDEC Compliance:
JEDEC LPDDR5 compliant
ECC Support:
On-die ECC
Process Technology:
1β/1γ nm-class DRAM
Power Saving Features:
DVFS, Deep Sleep, Self Refresh, Write-X
Bank Architecture:
Multi-channel LPDDR5 architecture
Refresh Mode:
Auto Refresh / Self Refresh
Temperature Grade:
Commercial Grade
Pin/Ball Count:
315-ball class
Package Size:
Advanced mobile FBGA
VDD/VDDQ:
VDD1=1.05V / VDDQ=0.5V
Clock Frequency:
3750 MHz
Organization:
1.5G ×64
Density:
96Gb
Data Rate:
7500 MT/s
I/O Width:
x64
Package Type:
FBGA
Interface Standard:
LPDDR5 SDRAM
Operating Temperature Range:
-25°C to +85°C
Model:
Order Number:
MT62F1536M64D8CL-026
Description:
Micron HBM high-bandwidth memory solution featuring advanced stacked DRAM architecture, ultra-wide interface design, and exceptional throughput for AI accelerators, HPC systems, and graphics processing applications.
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Micron | |
| JEDEC Compliance: | JEDEC LPDDR5 compliant | |
| ECC Support: | On-die ECC | |
| Process Technology: | 1β/1γ nm-class DRAM | |
| Power Saving Features: | DVFS, Deep Sleep, Self Refresh, Write-X | |
| Bank Architecture: | Multi-channel LPDDR5 architecture | |
| Refresh Mode: | Auto Refresh / Self Refresh | |
| Temperature Grade: | Commercial Grade | |
| Pin/Ball Count: | 315-ball class | |
| Package Size: | Advanced mobile FBGA | |
| VDD/VDDQ: | VDD1=1.05V / VDDQ=0.5V | |
| Clock Frequency: | 3750 MHz | |
| Organization: | 1.5G ×64 | |
| Density: | 96Gb | |
| Data Rate: | 7500 MT/s | |
| I/O Width: | x64 | |
| Package Type: | FBGA | |
| Interface Standard: | LPDDR5 SDRAM | |
| Operating Temperature Range: | -25°C to +85°C |
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