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K4U6E3S4AA-MGCL Samsung

Name: K4U6E3S4AA-MGCL Samsung
SKU: K4U6E3S4AA-MGCL

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC LPDDR4X compliant

ECC Support:

Process Technology:

10nm-class mobile DRAM

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-bank LPDDR4X architecture

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

200-ball class

Package Size:

Mobile FBGA

VDD/VDDQ:

VDD1=1.1V / VDDQ=0.6V

Clock Frequency:

2133 MHz

Organization:

768M ×8

Density:

6Gb

Data Rate:

4266 Mbps

I/O Width:

Package Type:

FBGA

Interface Standard:

LPDDR4X SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

K4U6E3S4AA-MGCL

Order Number:

K4U6E3S4AA-MGCL

Description:

Samsung low-power DRAM optimized for mobile and embedded platforms, providing efficient thermal characteristics, high-speed operation, and reduced energy consumption in compact electronic devices.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC LPDDR4X compliant
ECC Support：	No
Process Technology：	10nm-class mobile DRAM
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-bank LPDDR4X architecture
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	200-ball class
Package Size：	Mobile FBGA
VDD/VDDQ：	VDD1=1.1V / VDDQ=0.6V
Clock Frequency：	2133 MHz
Organization：	768M ×8
Density：	6Gb
Data Rate：	4266 Mbps
I/O Width：	x8
Package Type：	FBGA
Interface Standard：	LPDDR4X SDRAM
Operating Temperature Range：	-25°C to +85°C

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