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K4UBE3D4AB-KFCL Samsung

Name: K4UBE3D4AB-KFCL Samsung
SKU: K4UBE3D4AB-KFCL

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC LPDDR4X compliant

ECC Support:

Process Technology:

Samsung mobile DRAM process

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-bank LPDDR4X architecture

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

200-ball class

Package Size:

Mobile FBGA

VDD/VDDQ:

VDD1=1.1V / VDDQ=0.6V

Clock Frequency:

1866 MHz

Organization:

1.5G ×8

Density:

12Gb

Data Rate:

3733 Mbps

I/O Width:

Package Type:

FBGA

Interface Standard:

LPDDR4X SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

K4UBE3D4AB-KFCL

Order Number:

K4UBE3D4AB-KFCL

Description:

Samsung advanced LPDDR memory component featuring optimized energy efficiency, high data throughput, and compact package technology for next-generation smartphones and embedded platforms.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC LPDDR4X compliant
ECC Support：	No
Process Technology：	Samsung mobile DRAM process
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-bank LPDDR4X architecture
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	200-ball class
Package Size：	Mobile FBGA
VDD/VDDQ：	VDD1=1.1V / VDDQ=0.6V
Clock Frequency：	1866 MHz
Organization：	1.5G ×8
Density：	12Gb
Data Rate：	3733 Mbps
I/O Width：	x8
Package Type：	FBGA
Interface Standard：	LPDDR4X SDRAM
Operating Temperature Range：	-25°C to +85°C

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K4UBE3D4AB-KFCL Samsung

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