K4E6E304ED-EGCG Samsung
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| JEDEC Compliance: | JEDEC GDDR6 compliant | |
| ECC Support: | No | |
| Process Technology: | 10nm-class graphics DRAM | |
| Power Saving Features: | Low Power Modes, Dynamic Refresh | |
| Bank Architecture: | 16 Banks / Bank Groups | |
| Refresh Mode: | Auto Refresh / Self Refresh | |
| Temperature Grade: | Commercial Grade | |
| Pin/Ball Count: | 180 balls | |
| Package Size: | 180-ball FBGA | |
| VDD/VDDQ: | 1.35V | |
| Clock Frequency: | 1750 MHz | |
| Organization: | 192M ×32 | |
| Density: | 6Gb | |
| Data Rate: | 14 Gbps | |
| I/O Width: | x32 | |
| Package Type: | FBGA | |
| Interface Standard: | GDDR6 SDRAM | |
| Operating Temperature Range: | 0°C to +95°C |

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