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K4E6E304ED-EGCG Samsung

Name: K4E6E304ED-EGCG Samsung
SKU: K4E6E304ED-EGCG

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC GDDR6 compliant

ECC Support:

Process Technology:

10nm-class graphics DRAM

Power Saving Features:

Low Power Modes, Dynamic Refresh

Bank Architecture:

16 Banks / Bank Groups

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

180 balls

Package Size:

180-ball FBGA

VDD/VDDQ:

1.35V

Clock Frequency:

1750 MHz

Organization:

192M ×32

Density:

6Gb

Data Rate:

14 Gbps

I/O Width:

x32

Package Type:

FBGA

Interface Standard:

GDDR6 SDRAM

Operating Temperature Range:

0°C to +95°C

Model:

K4E6E304ED-EGCG

Order Number:

K4E6E304ED-EGCG

Description:

Samsung graphics-oriented DRAM designed for high-bandwidth data processing, low latency operation, and efficient thermal management in graphics cards, multimedia processors, and AI acceleration platforms.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC GDDR6 compliant
ECC Support：	No
Process Technology：	10nm-class graphics DRAM
Power Saving Features：	Low Power Modes, Dynamic Refresh
Bank Architecture：	16 Banks / Bank Groups
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	180 balls
Package Size：	180-ball FBGA
VDD/VDDQ：	1.35V
Clock Frequency：	1750 MHz
Organization：	192M ×32
Density：	6Gb
Data Rate：	14 Gbps
I/O Width：	x32
Package Type：	FBGA
Interface Standard：	GDDR6 SDRAM
Operating Temperature Range：	0°C to +95°C

Products with the same attribute : 0

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K4E6E304ED-EGCG Samsung

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