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K4A8G165WG-BCWE
Brand:
JEDEC Compliance:
JEDEC DDR4
ECC Support:
No
Process Technology:
1x nm DRAM
Power Saving Features:
Self Refresh, Power-Down Mode
Bank Architecture:
16 Banks / 4 Bank Groups
Refresh Mode:
Auto Refresh / Self Refresh
Temperature Grade:
Commercial
Pin/Ball Count:
96-ball
Package Size:
9 × 14 mm
VDD/VDDQ:
1.2V
Clock Frequency:
1600 MHz
Organization:
512M × 16
Density:
8Gb
Data Rate:
3200 MT/s
I/O Width:
x16
Package Type:
FBGA
Interface Standard:
DDR4 SDRAM
Operating Temperature Range:
0°C to +95°C
Model:
K4A8G165WG-BCWE
Order Number:
K4A8G165WG-BCWE
Description:
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand： | Samsung Semiconductor | |
| JEDEC Compliance： | JEDEC DDR4 | |
| ECC Support： | No | |
| Process Technology： | 1x nm DRAM | |
| Power Saving Features： | Self Refresh, Power-Down Mode | |
| Bank Architecture： | 16 Banks / 4 Bank Groups | |
| Refresh Mode： | Auto Refresh / Self Refresh | |
| Temperature Grade： | Commercial | |
| Pin/Ball Count： | 96-ball | |
| Package Size： | 9 × 14 mm | |
| VDD/VDDQ： | 1.2V | |
| Clock Frequency： | 1600 MHz | |
| Organization： | 512M × 16 | |
| Density： | 8Gb | |
| Data Rate： | 3200 MT/s | |
| I/O Width： | x16 | |
| Package Type： | FBGA | |
| Interface Standard： | DDR4 SDRAM | |
| Operating Temperature Range： | 0°C to +95°C |
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Tom
Hi, I'm Tom. With 7 years of experience in the industrial control industry, I combine deep professionalism with a friendly, client-first approach. I am dedicated to providing complete, end-to-end services to support your business needs. Let’s collaborate to achieve your goals—please feel free to contact me today!