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K4FBE3D4HM-MGCJ Samsung

Name: K4FBE3D4HM-MGCJ Samsung
SKU: K4FBE3D4HM-MGCJ

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC LPDDR5X compliant

ECC Support:

Process Technology:

12nm-class mobile DRAM process

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-bank LPDDR5X architecture

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

200-ball class

Package Size:

Mobile FBGA

VDD/VDDQ:

VDD1=1.05V / VDDQ=0.5V

Clock Frequency:

3750 MHz

Organization:

1.5G ×8

Density:

12Gb

Data Rate:

7500 Mbps

I/O Width:

Package Type:

FBGA

Interface Standard:

LPDDR5X SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

K4FBE3D4HM-MGCJ

Order Number:

K4FBE3D4HM-MGCJ

Description:

Samsung advanced mobile DRAM supporting high-speed data processing, low standby power, and robust reliability for smartphones, portable gaming systems, and embedded multimedia applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC LPDDR5X compliant
ECC Support：	No
Process Technology：	12nm-class mobile DRAM process
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-bank LPDDR5X architecture
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	200-ball class
Package Size：	Mobile FBGA
VDD/VDDQ：	VDD1=1.05V / VDDQ=0.5V
Clock Frequency：	3750 MHz
Organization：	1.5G ×8
Density：	12Gb
Data Rate：	7500 Mbps
I/O Width：	x8
Package Type：	FBGA
Interface Standard：	LPDDR5X SDRAM
Operating Temperature Range：	-25°C to +85°C

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K4FBE3D4HM-MGCJ Samsung

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