K4ZAF325BC-SC16
Brand:
JEDEC Compliance:
GDDR6 JEDEC
ECC Support:
On-die ECC
Process Technology:
10nm-class DRAM
Power Saving Features:
Deep Power Down, Self Refresh
Bank Architecture:
16 Banks
Refresh Mode:
Auto Refresh
Temperature Grade:
Commercial
Pin/Ball Count:
180-ball
Package Size:
14 × 12 mm
VDD/VDDQ:
1.35V
Clock Frequency:
2000 MHz
Organization:
256M × 32
Density:
8Gb
Data Rate:
16 Gb/s
I/O Width:
x32
Package Type:
FBGA
Interface Standard:
GDDR6 SDRAM
Operating Temperature Range:
0°C to +95°C
Model:
K4ZAF325BC-SC16
Order Number:
K4ZAF325BC-SC16
Description:
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| JEDEC Compliance: | GDDR6 JEDEC | |
| ECC Support: | On-die ECC | |
| Process Technology: | 10nm-class DRAM | |
| Power Saving Features: | Deep Power Down, Self Refresh | |
| Bank Architecture: | 16 Banks | |
| Refresh Mode: | Auto Refresh | |
| Temperature Grade: | Commercial | |
| Pin/Ball Count: | 180-ball | |
| Package Size: | 14 × 12 mm | |
| VDD/VDDQ: | 1.35V | |
| Clock Frequency: | 2000 MHz | |
| Organization: | 256M × 32 | |
| Density: | 8Gb | |
| Data Rate: | 16 Gb/s | |
| I/O Width: | x32 | |
| Package Type: | FBGA | |
| Interface Standard: | GDDR6 SDRAM | |
| Operating Temperature Range: | 0°C to +95°C |
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Tom
Hi, I'm Tom. With 7 years of experience in the industrial control industry, I combine deep professionalism with a friendly, client-first approach. I am dedicated to providing complete, end-to-end services to support your business needs. Let’s collaborate to achieve your goals—please feel free to contact me today!





























































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