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KMDX60018M-B425 Samsung

Name: KMDX60018M-B425 Samsung
SKU: KMDX60018M-B425

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC Mobile DDR compliant

ECC Support:

Process Technology:

Mobile DRAM process

Power Saving Features:

Partial Array Self Refresh (PASR), Deep Power Down

Bank Architecture:

4 Banks

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

90-ball class

Package Size:

Mobile FBGA

VDD/VDDQ:

1.8V

Clock Frequency:

200 MHz

Organization:

32M ×16

Density:

512Mb

Data Rate:

400 Mbps

I/O Width:

x16

Package Type:

FBGA

Interface Standard:

Mobile DDR SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

KMDX60018M-B425

Order Number:

KMDX60018M-B425

Description:

Samsung multi-chip memory package integrating advanced DRAM technology with compact package design, optimized power management, and reliable high-speed performance for embedded, mobile, and industrial computing applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC Mobile DDR compliant
ECC Support：	No
Process Technology：	Mobile DRAM process
Power Saving Features：	Partial Array Self Refresh (PASR), Deep Power Down
Bank Architecture：	4 Banks
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	90-ball class
Package Size：	Mobile FBGA
VDD/VDDQ：	1.8V
Clock Frequency：	200 MHz
Organization：	32M ×16
Density：	512Mb
Data Rate：	400 Mbps
I/O Width：	x16
Package Type：	FBGA
Interface Standard：	Mobile DDR SDRAM
Operating Temperature Range：	-25°C to +85°C

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