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K3LKCKC0BM-MGCP Samsung

Name: K3LKCKC0BM-MGCP Samsung
SKU: K3LKCKC0BM-MGCP

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC LPDDR5X + UFS 3.1 compliant

ECC Support:

Process Technology:

Samsung 12nm-class LPDDR5X process

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-bank LPDDR5X architecture

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

297 balls

Package Size:

297-FBGA class

VDD/VDDQ:

1.8V / 1.05V / 0.5V

Clock Frequency:

4266 MHz

Organization:

LPDDR5X + UFS integrated

Density:

uMCP (LPDDR5X + UFS 3.1)

Data Rate:

8533 Mbps

I/O Width:

x64

Package Type:

uMCP FBGA

Interface Standard:

LPDDR5X + UFS 3.1

Operating Temperature Range:

-25°C to +85°C

Model:

K3LKCKC0BM-MGCP

Order Number:

K3LKCKC0BM-MGCP

Description:

Samsung high-performance LPDDR5 DRAM providing fast data access, reduced standby power, and reliable operation for premium mobile devices, portable gaming systems, and advanced embedded applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC LPDDR5X + UFS 3.1 compliant
ECC Support：	No
Process Technology：	Samsung 12nm-class LPDDR5X process
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-bank LPDDR5X architecture
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	297 balls
Package Size：	297-FBGA class
VDD/VDDQ：	1.8V / 1.05V / 0.5V
Clock Frequency：	4266 MHz
Organization：	LPDDR5X + UFS integrated
Density：	uMCP (LPDDR5X + UFS 3.1)
Data Rate：	8533 Mbps
I/O Width：	x64
Package Type：	uMCP FBGA
Interface Standard：	LPDDR5X + UFS 3.1
Operating Temperature Range：	-25°C to +85°C

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K3LKCKC0BM-MGCP Samsung

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