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K3LK5K50BM-BGCP Samsung
Brand:
JEDEC Compliance:
JEDEC LPDDR5 + UFS 3.1 compliant
ECC Support:
No
Process Technology:
Samsung 10nm-class LPDDR5 process
Power Saving Features:
Deep Sleep, DVFS, Self Refresh
Bank Architecture:
Multi-bank LPDDR5 architecture
Refresh Mode:
Auto Refresh / Self Refresh
Temperature Grade:
Commercial Grade
Pin/Ball Count:
297 balls
Package Size:
297-FBGA package class
VDD/VDDQ:
1.8V / 1.05V / 0.9V / 0.5V
Clock Frequency:
3200 MHz
Organization:
LPDDR5 + UFS integrated
Density:
128Gb (uMCP total class)
Data Rate:
6400 Mbps
I/O Width:
x64 (LPDDR5 DRAM bus)
Package Type:
uMCP FBGA
Interface Standard:
LPDDR5 + UFS 3.1
Operating Temperature Range:
-25°C to +85°C
Model:
K3LK5K50BM-BGCP
Order Number:
K3LK5K50BM-BGCP
Description:
Samsung LPDDR5 mobile DRAM optimized for ultra-low power consumption, high data throughput, and compact integration in smartphones, tablets, AI edge devices, and advanced mobile computing platforms.
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand： | Samsung Semiconductor | |
| JEDEC Compliance： | JEDEC LPDDR5 + UFS 3.1 compliant | |
| ECC Support： | No | |
| Process Technology： | Samsung 10nm-class LPDDR5 process | |
| Power Saving Features： | Deep Sleep, DVFS, Self Refresh | |
| Bank Architecture： | Multi-bank LPDDR5 architecture | |
| Refresh Mode： | Auto Refresh / Self Refresh | |
| Temperature Grade： | Commercial Grade | |
| Pin/Ball Count： | 297 balls | |
| Package Size： | 297-FBGA package class | |
| VDD/VDDQ： | 1.8V / 1.05V / 0.9V / 0.5V | |
| Clock Frequency： | 3200 MHz | |
| Organization： | LPDDR5 + UFS integrated | |
| Density： | 128Gb (uMCP total class) | |
| Data Rate： | 6400 Mbps | |
| I/O Width： | x64 (LPDDR5 DRAM bus) | |
| Package Type： | uMCP FBGA | |
| Interface Standard： | LPDDR5 + UFS 3.1 | |
| Operating Temperature Range： | -25°C to +85°C |
Products with the same attribute : 0
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