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K4B2G1646F-BYMA Samsung

Name: K4B2G1646F-BYMA Samsung
SKU: K4B2G1646F-BYMA

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC DDR3 compliant

ECC Support:

Process Technology:

20nm-class DRAM

Power Saving Features:

Power-Down, Self Refresh, DLL-off

Bank Architecture:

8 Banks

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

96 balls

Package Size:

96-ball FBGA

VDD/VDDQ:

1.5V / 1.5V

Clock Frequency:

1066 MHz

Organization:

128M ×16

Density:

2Gb

Data Rate:

2133 Mbps

I/O Width:

x16

Package Type:

FBGA

Interface Standard:

DDR3 SDRAM

Operating Temperature Range:

0°C to +85°C

Model:

K4B2G1646F-BYMA

Order Number:

K4B2G1646F-BYMA

Description:

Samsung DDR3 SDRAM component designed for efficient memory performance, reduced power requirements, and stable operation in consumer electronics, industrial controllers, and compact computing systems.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC DDR3 compliant
ECC Support：	No
Process Technology：	20nm-class DRAM
Power Saving Features：	Power-Down, Self Refresh, DLL-off
Bank Architecture：	8 Banks
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	96 balls
Package Size：	96-ball FBGA
VDD/VDDQ：	1.5V / 1.5V
Clock Frequency：	1066 MHz
Organization：	128M ×16
Density：	2Gb
Data Rate：	2133 Mbps
I/O Width：	x16
Package Type：	FBGA
Interface Standard：	DDR3 SDRAM
Operating Temperature Range：	0°C to +85°C

Products with the same attribute : 0

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K4B2G1646F-BYMA Samsung

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