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K4U6E3S4AB-KHCL Samsung

Name: K4U6E3S4AB-KHCL Samsung
SKU: K4U6E3S4AB-KHCL

Brand:

Samsung Semiconductor

JEDEC Compliance:

JEDEC LPDDR4X compliant

ECC Support:

Process Technology:

Samsung mobile DRAM process

Power Saving Features:

DVFS, Deep Sleep, Self Refresh

Bank Architecture:

Multi-bank LPDDR4X architecture

Refresh Mode:

Auto Refresh / Self Refresh

Temperature Grade:

Commercial Grade

Pin/Ball Count:

200-ball class

Package Size:

Mobile FBGA

VDD/VDDQ:

VDD1=1.1V / VDDQ=0.6V

Clock Frequency:

1866 MHz

Organization:

768M ×8

Density:

6Gb

Data Rate:

3733 Mbps

I/O Width:

Package Type:

FBGA

Interface Standard:

LPDDR4X SDRAM

Operating Temperature Range:

-25°C to +85°C

Model:

K4U6E3S4AB-KHCL

Order Number:

K4U6E3S4AB-KHCL

Description:

Samsung high-performance low-power DRAM delivering reliable bandwidth, advanced energy efficiency, and compact packaging for modern mobile computing and multimedia processing applications.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	Samsung Semiconductor
JEDEC Compliance：	JEDEC LPDDR4X compliant
ECC Support：	No
Process Technology：	Samsung mobile DRAM process
Power Saving Features：	DVFS, Deep Sleep, Self Refresh
Bank Architecture：	Multi-bank LPDDR4X architecture
Refresh Mode：	Auto Refresh / Self Refresh
Temperature Grade：	Commercial Grade
Pin/Ball Count：	200-ball class
Package Size：	Mobile FBGA
VDD/VDDQ：	VDD1=1.1V / VDDQ=0.6V
Clock Frequency：	1866 MHz
Organization：	768M ×8
Density：	6Gb
Data Rate：	3733 Mbps
I/O Width：	x8
Package Type：	FBGA
Interface Standard：	LPDDR4X SDRAM
Operating Temperature Range：	-25°C to +85°C

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K4U6E3S4AB-KHCL Samsung

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