K4AAG165WA-BCWE Samsung
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| JEDEC Compliance: | JEDEC DDR5 compliant | |
| ECC Support: | On-die ECC | |
| Process Technology: | 14nm/12nm-class DRAM | |
| Power Saving Features: | Power-Down, Self Refresh, DFE | |
| Bank Architecture: | 32 Banks / 8 Bank Groups | |
| Refresh Mode: | Auto Refresh / Self Refresh | |
| Temperature Grade: | Commercial Grade | |
| Pin/Ball Count: | 96 balls | |
| Package Size: | 96-ball FBGA | |
| VDD/VDDQ: | VDD=1.1V / VDDQ=1.1V | |
| Clock Frequency: | 2800 MHz | |
| Organization: | 1G ×16 | |
| Density: | 16Gb | |
| Data Rate: | 5600 Mbps | |
| I/O Width: | x16 | |
| Package Type: | FBGA | |
| Interface Standard: | DDR5 SDRAM | |
| Operating Temperature Range: | 0°C to +85°C |

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