KLMBG2JETD-B041
Brand:
Internal Features:
V-NAND flash management, secure erase, cache optimization
Random Read:
Up to 13K IOPS
Sequential Read:
Read up to 320 MB/s
Storage Capacity:
64GB
Pin Assignment:
153-ball FBGA
Package Type:
FBGA
Power Consumption Characteristics:
Dynamic voltage scaling support
Speed Mode:
HS400
Bus Width:
x8
Interface Standard:
eMMC 5.1
Operating Temperature Range:
-25°C to +85°C
Operating Voltage:
VCC=2.7–3.6V, VCCQ=1.8V
Model:
KLMBG2JETD-B041
Order Number:
KLMBG2JETD-B041
Description:
Samsung embedded flash memory component optimized for low-voltage operation, efficient storage management, and reliable multimedia data handling in industrial automation, networking devices, and mobile electronic platforms.
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| Internal Features: | V-NAND flash management, secure erase, cache optimization | |
| Random Read: | Up to 13K IOPS | |
| Sequential Read: | Read up to 320 MB/s | |
| Storage Capacity: | 64GB | |
| Pin Assignment: | 153-ball FBGA | |
| Package Type: | FBGA | |
| Power Consumption Characteristics: | Dynamic voltage scaling support | |
| Speed Mode: | HS400 | |
| Bus Width: | x8 | |
| Interface Standard: | eMMC 5.1 | |
| Operating Temperature Range: | -25°C to +85°C | |
| Operating Voltage: | VCC=2.7–3.6V, VCCQ=1.8V |
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Tom
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