KLMDG2RCTE-B041
Brand:
Internal Features:
Internal ECC, intelligent wear leveling, cache acceleration
Random Read:
Up to 16K IOPS
Sequential Read:
Read up to 320 MB/s
Storage Capacity:
256GB
Pin Assignment:
153-ball FBGA
Package Type:
FBGA
Power Consumption Characteristics:
Low-power V-NAND operation
Speed Mode:
HS400
Bus Width:
x8
Interface Standard:
eMMC 5.1
Operating Temperature Range:
-25°C to +85°C
Operating Voltage:
VCC=2.7–3.6V, VCCQ=1.8V
Model:
KLMDG2RCTE-B041
Order Number:
KLMDG2RCTE-B041
Description:
Samsung eMMC managed flash storage component engineered for high-reliability embedded systems, supporting efficient wear leveling, advanced ECC functionality, and stable performance in industrial and consumer electronic environments.
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| Internal Features: | Internal ECC, intelligent wear leveling, cache acceleration | |
| Random Read: | Up to 16K IOPS | |
| Sequential Read: | Read up to 320 MB/s | |
| Storage Capacity: | 256GB | |
| Pin Assignment: | 153-ball FBGA | |
| Package Type: | FBGA | |
| Power Consumption Characteristics: | Low-power V-NAND operation | |
| Speed Mode: | HS400 | |
| Bus Width: | x8 | |
| Interface Standard: | eMMC 5.1 | |
| Operating Temperature Range: | -25°C to +85°C | |
| Operating Voltage: | VCC=2.7–3.6V, VCCQ=1.8V |
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