KLMAG1JENB-B041
Brand:
Internal Features:
NAND management, ECC engine, secure trim, cache acceleration
Random Read:
Up to 10K IOPS
Sequential Read:
Read up to 300 MB/s
Storage Capacity:
16GB
Pin Assignment:
153-ball FBGA
Package Type:
FBGA
Power Consumption Characteristics:
Advanced low-power standby mode
Speed Mode:
HS400
Bus Width:
x8
Interface Standard:
eMMC 5.1
Operating Temperature Range:
-25°C to +85°C
Operating Voltage:
VCC=2.7–3.6V, VCCQ=1.8V
Model:
KLMAG1JENB-B041
Order Number:
KLMAG1JENB-B041
Description:
Samsung eMMC flash memory component designed for reliable embedded storage, advanced wear leveling, and efficient error correction performance in mobile devices, networking equipment, automotive systems, and portable electronic products.
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Samsung Semiconductor | |
| Internal Features: | NAND management, ECC engine, secure trim, cache acceleration | |
| Random Read: | Up to 10K IOPS | |
| Sequential Read: | Read up to 300 MB/s | |
| Storage Capacity: | 16GB | |
| Pin Assignment: | 153-ball FBGA | |
| Package Type: | FBGA | |
| Power Consumption Characteristics: | Advanced low-power standby mode | |
| Speed Mode: | HS400 | |
| Bus Width: | x8 | |
| Interface Standard: | eMMC 5.1 | |
| Operating Temperature Range: | -25°C to +85°C | |
| Operating Voltage: | VCC=2.7–3.6V, VCCQ=1.8V |
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