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H58G56BK8QX068N SK Hynix

Name: H58G56BK8QX068N SK Hynix
SKU: H58G56BK8QX068N

Brand:

SK Hynix

ECC Requirement:

On-die ECC

Erase Time:

N/A

Program Time:

N/A

Spare Area Size:

N/A

Block Size:

N/A

Page Size:

N/A

NAND Architecture:

LPDDR5X DRAM

Read Access Time:

Up to 8533Mbps

Storage Capacity:

32Gb

Package Type:

FBGA

Bus Width:

x16

Interface Standard:

LPDDR5X

Interface Type:

Mobile DRAM

Operating Temperature Range:

-25°C to 85°C

Operating Voltage:

1.05V / 0.5V

Model:

H58G56BK8QX068N

Order Number:

H58G56BK8QX068N

Description:

SK hynix H58G56BK8QX068N is a 32Gbit LPDDR5/LPDDR5X mobile DRAM memory component designed for high-performance smartphones, AI edge devices and mobile computing applications, providing high bandwidth, low power consumption and advanced signal integrity for next-generation embedded systems.

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Product parameters

Product parameters

Product attributes	Attribute value	Filter product attributes
Brand：	SK Hynix
ECC Requirement：	On-die ECC
Erase Time：	N/A
Program Time：	N/A
Spare Area Size：	N/A
Block Size：	N/A
Page Size：	N/A
NAND Architecture：	LPDDR5X DRAM
Read Access Time：	Up to 8533Mbps
Storage Capacity：	32Gb
Package Type：	FBGA
Bus Width：	x16
Interface Standard：	LPDDR5X
Interface Type：	Mobile DRAM
Operating Temperature Range：	-25°C to 85°C
Operating Voltage：	1.05V / 0.5V

Products with the same attribute : 0

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H58G56BK8QX068N SK Hynix

Product parameters

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