W972GG6KB-25
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand: | Winbond | |
| JEDEC Compliance: | JESD79-3 DDR3 | |
| ECC Support: | No | |
| Process Technology: | 25nm Class | |
| Power Saving Features: | Self Refresh,Power Down | |
| Bank Architecture: | 8 Banks | |
| Refresh Mode: | Auto Refresh,Self Refresh | |
| Temperature Grade: | Commercial | |
| Pin/Ball Count: | 96 Balls | |
| Package Size: | 8×14 mm | |
| VDD/VDDQ: | 1.5V/1.5V | |
| Clock Frequency: | 800 MHz | |
| Organization: | 128M x16 | |
| Density: | 2Gb | |
| Data Rate: | 1600 MT/s | |
| I/O Width: | x16 | |
| Package Type: | FBGA-96 | |
| Interface Standard: | DDR3 SDRAM | |
| Operating Temperature Range: | 0C to +95C |

Tom Manager
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