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K4B4G1646E-BCNB000
Brand:
JEDEC Compliance:
JEDEC DDR3L
ECC Support:
No
Process Technology:
2x nm DRAM
Power Saving Features:
Self Refresh, PASR, Power-Down
Bank Architecture:
8 Banks
Refresh Mode:
Auto Refresh / Self Refresh
Temperature Grade:
Commercial
Pin/Ball Count:
96-ball
Package Size:
8 × 14 mm
VDD/VDDQ:
1.35V / 1.5V
Clock Frequency:
933 MHz
Organization:
256M × 16
Density:
4Gb
Data Rate:
1866 MT/s
I/O Width:
x16
Package Type:
FBGA
Interface Standard:
DDR3L SDRAM
Operating Temperature Range:
0°C to +95°C
Model:
K4B4G1646E-BCNB000
Order Number:
K4B4G1646E-BCNB000
Description:
Product parameters
| Product attributes | Attribute value | Filter product attributes |
|---|---|---|
| Brand： | Samsung Semiconductor | |
| JEDEC Compliance： | JEDEC DDR3L | |
| ECC Support： | No | |
| Process Technology： | 2x nm DRAM | |
| Power Saving Features： | Self Refresh, PASR, Power-Down | |
| Bank Architecture： | 8 Banks | |
| Refresh Mode： | Auto Refresh / Self Refresh | |
| Temperature Grade： | Commercial | |
| Pin/Ball Count： | 96-ball | |
| Package Size： | 8 × 14 mm | |
| VDD/VDDQ： | 1.35V / 1.5V | |
| Clock Frequency： | 933 MHz | |
| Organization： | 256M × 16 | |
| Density： | 4Gb | |
| Data Rate： | 1866 MT/s | |
| I/O Width： | x16 | |
| Package Type： | FBGA | |
| Interface Standard： | DDR3L SDRAM | |
| Operating Temperature Range： | 0°C to +95°C |
Products with the same attribute : 0
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Tom
Hi, I'm Tom. With 7 years of experience in the industrial control industry, I combine deep professionalism with a friendly, client-first approach. I am dedicated to providing complete, end-to-end services to support your business needs. Let’s collaborate to achieve your goals—please feel free to contact me today!